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Brand Name : Bicheng
Model Number : BIC-332.V1.0
Certification : UL, ISO9001, IATF16949
Place of Origin : CHINA
MOQ : 1PCS
Price : USD9.99-99.99
Payment Terms : T/T
Supply Ability : 5000PCS per month
Delivery Time : 8-9 working days
Packaging Details : Vacuum bags+Cartons
Base material : Rogers TC600
Layer count : 2 layers
PCB thickness : 0.8mm
PCB size : 112mm x 60mm (1 piece)±0.15mm
Silkscreen : White
Solder mask : Green
Copper weight : 1oz (1.4 mils) for outer layers
Surface finish : Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
| Parameter | Details |
|---|---|
| Base Material | Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement) |
| Layer Count | Double sided (2-layer rigid PCB) |
| Board Dimensions | 112mm x 60mm (1 piece)±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (1.4 mils total: 18μm base copper + 17μm plating per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG) |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
| Layer Type | Material/Description | Thickness |
|---|---|---|
| Copper Layer (Top) | 18μm base copper + 17μm plating (finished: 1oz / 35μm total) | 35 μm (1oz) |
| Dielectric Layer | Rogers TC600 | 0.762 mm (30 mils) |
| Copper Layer (Bottom) | 18μm base copper + 17μm plating (finished: 1oz / 35μm total) | 35 μm (1oz) |
| Specification | Value |
|---|---|
| Material Type | PTFE + thermally conductive ceramic fillers + woven glass reinforcement |
| Dielectric Constant (Dk) | 6.15 at 1.8 MHz and 10 GHz / 23°C |
| Dissipation Factor (tanδ) | 0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C |
| Thermal Conductivity | 1.1 W/mK |
| Temperature Coefficient of Dielectric Constant (TCDk) | -75 ppm/°C (range: -40°C to 140°C) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C |
| Moisture Absorption | 0.03% |
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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish Images |