In search of a high-performance 2-layer rigid PCB tailored for 5G and millimeter wave uses? This 2-layer rigid PCB is constructed with CLTE-MW copper clad laminates—a high-performance, cost-efficient material reinforced with spread glass and high filler content—crafted to meet the needs of applications with thickness restrictions while preserving exceptional signal integrity. Compliant with IPC-Class 2 quality standards, this PCB delivers dependable performance for critical uses such as commercial communications, military/aerospace equipment, and satellite communication systems. Focused on precision, low-loss performance, and cost-effectiveness, it is the perfect choice for engineers and procurement teams seeking a reliable substrate for high-frequency, thickness-constrained projects.
PCB Specifications
| Construction Item |
Details |
| Board Dimensions |
76.4mm x 95mm (1PCS), featuring a tight tolerance of +/- 0.15mm to ensure a precise fit in your assemblies |
| Trace & Space |
Minimum 6/7 mils, allowing for compact circuit design without sacrificing signal integrity |
| Minimum Hole Size |
0.25mm, compatible with standard component mounting requirements for precision-focused applications |
| Vias |
No blind vias, streamlining the manufacturing process while ensuring secure interlayer connections |
| Finished Board Thickness |
0.15mm, perfect for applications subject to physical or electrical thickness limitations |
| Copper Weight |
1oz (1.4 mils) on outer layers (35μm), delivering excellent conductivity for high-frequency signals |
| Via Plating Thickness |
20μm, meeting IPC-Class 2 standards to ensure reliable electrical connections and mechanical durability |
| Surface Finish |
Immersion Gold, providing superior solderability, corrosion resistance, and compatibility with modern assembly techniques for high-reliability applications |
| Silkscreen & Solder Mask |
Black top silkscreen (no bottom silkscreen); no top or bottom solder mask, ensuring a clean design optimized for high-frequency signal performance |
| Quality Testing |
100% electrical testing conducted before shipment, guaranteeing functionality and eliminating defective units |
PCB Stack-up Configuration
| Stackup Component |
Specifications & Description |
| Copper Layer 1 |
35μm – Ensures efficient signal transmission and thermal conductivity for high-frequency applications |
| CLTE-MW Core |
0.076mm (2.99mil) – The foundation of the PCB’s outstanding low-loss performance, ideal for thickness-constrained projects |
| Copper Layer 2 |
35μm – Delivers consistent conductivity and symmetry for balanced signal flow in high-frequency circuits |
Quality & Availability
Quality Standard: IPC-Class 2 – Meets the industry’s most common quality requirements for dedicated service electronic products, ensuring reliable performance and an extended service life.
Availability: Worldwide – We offer global shipping to meet the needs of engineers and manufacturers around the world, with industry-acceptable delivery times.
CLTE-MW Substrate: The Key to Exceptional Performance
CLTE-MW copper clad laminates form the backbone of our PCB’s superior performance, engineered to meet the demands of 5G, millimeter wave, and thickness-constrained high-frequency applications:
CLTE-MW laminates provide PCB designers with a high-performance, cost-effective material that is well-suited for applications limited by physical or electrical thickness constraints. This unique laminate system comes in seven thickness options, ranging from 3 to 10 mils, ensuring optimal signal-to-ground spacing for 5G and other millimeter wave applications. Reinforced with spread glass and high filler loading, CLTE-MW laminates help reduce the impact of high-frequency glass weave on electromagnetic wave propagation. As a ceramic-filled PTFE composite, CLTE-MW is specifically developed for the 24GHz to 77+GHz frequency range, delivering low-loss performance without the high cost of premium alternatives.
Engineered for cost-effectiveness and versatility, CLTE-MW addresses the critical need for low-loss, thin-substrate solutions in modern high-frequency electronics. Its spread glass reinforcement and high filler loading not only reduce signal distortion but also enhance mechanical stability, making it ideal for demanding environments such as military and aerospace applications.
Key Features of the CLTE-MW PCB
Our CLTE-MW 2-layer PCB offers industry-leading features that distinguish it for 5G, millimeter wave, and thickness-constrained applications:
Low Loss Tangent: 0.0015 at 10GHz – Reduces signal loss to ensure reliable high-frequency and millimeter wave performance, on par with premium PTFE materials
Low Z-axis CTE: 30ppm/°C – Ensures excellent plated through hole (PTH) reliability and dimensional stability across temperature fluctuations
Thermal Conductivity: 0.42 W/(mK) – Improves heat dissipation in demanding designs, preventing overheating in high-power applications
Flammability Rating: UL94 V-0 – Meets strict safety standards for electronic devices used in commercial, military, and aerospace applications
Benefits of Choosing the CLTE-MW PCB
Our PCB provides tangible advantages for engineers, manufacturers, and procurement teams working on high-frequency, thickness-constrained projects:
Enables Low Loss Designs – Reduces signal distortion, ensuring reliable performance in 5G and millimeter wave applications
Excellent Plated Through Hole (PTH) Reliability – Lowers the risk of connection failure, which is critical for high-reliability applications like military and aerospace
Good Heat Dissipation – Supports demanding designs by efficiently dissipating heat, extending the service life of electronic components
Compatible with Commercial Applications – Offers a cost-effective solution without compromising performance for commercial communications and avionics
Reliable Mechanical Performance – Maintains stability in thermally challenging environments, making it ideal for harsh operating conditions
Applications
Our CLTE-MW 2-layer PCB is specifically designed for high-frequency, high-reliability, and thickness-constrained applications, including:
- Commercial Communications and Avionics
- Military/ Aerospace Applications
- Microwave Feed Networks
- Phase Sensitive Electronic Structures
- Satellite Communication Systems
- Passive Components (couplers, filters & baluns)
